Features overview

CPUs

APUs

APU features table

Initial platform (2003)

Launched in 2003, the initial platform for mobile AMD processors consists of:

AMD mobile Initial platform
Mobile processor Processors - Socket 754
Mobile chipset D-sub and HyperTransport 1.0

Mobile Sempron

"Dublin" (Socket 754, CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

Model NumberFrequencyL2 CacheHyperTransportMult.2VoltageTDPRelease DatePart Number(s)
Mobile Sempron 2600+1600 MHz128 kB800 MHz8x0.95 - 1.4 V13 - 62 WJuly 28, 2004SMN2600BIX2AY
Mobile Sempron 2800+1600 MHz256 kB800 MHz8x0.95 - 1.4 V13 - 62 WJuly 28, 2004SMN2800BIX3AY
Mobile Sempron 3000+1800 MHz128 kB800 MHz9x0.95 - 1.4 V13 - 62 WJuly 28, 2004SMN3000BIX2AY

"Dublin" (Socket 754, CG, 130 nm, Low power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

Model NumberFrequencyL2 CacheHyperTransportMult.2VoltageTDPRelease DatePart Number(s)
Mobile Sempron 2600+1600 MHz128 kB800 MHz8x0.975 - 1.25 V9 - 25 WJuly 28, 2004SMS2600BOX2LA
Mobile Sempron 2800+1600 MHz256 kB800 MHz8x0.975 - 1.25 V9 - 25 WJuly 28, 2004SMS2800BOX3LA

"Georgetown" (Socket 754, D0, 90 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

Model NumberFrequencyL2 CacheHyperTransportMult.2VoltageTDPRelease DatePart Number(s)
Mobile Sempron 2600+1600 MHz128 kB800 MHz8x0.95 - 1.4 V62 WJuly 2004SMN2600BIX2BA
Mobile Sempron 2800+1600 MHz256 kB800 MHz8x0.95 - 1.4 V62 WJuly 2004SMN2800BIX3BA
Mobile Sempron 3000+1800 MHz128 kB800 MHz9x0.95 - 1.4 V62 WJuly 2004SMN3000BIX2BA
Mobile Sempron 3100+1800 MHz256 kB800 MHz9x0.95 - 1.4 V62 WMay 3, 2005SMN3100BIX3BA
Mobile Sempron 3300+2000 MHz128 kB800 MHz10x0.95 - 1.4 V62 WAugust 19, 2005SMN3300BIX2BA

"Sonora" (Socket 754, D0, 90 nm, Low power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

Model NumberFrequencyL2 CacheHyperTransportMult.2VoltageTDPRelease DatePart Number(s)
Mobile Sempron 2600+1600 MHz128 kB800 MHz8x0.975 - 1.25 V25 WJuly 2004SMS2600BOX2LB
Mobile Sempron 2800+1600 MHz256 kB800 MHz8x0.975 - 1.25 V25 WJuly 2004SMS2800BOX3LB
Mobile Sempron 3000+1800 MHz128 kB800 MHz9x0.975 - 1.25 V25 WNovember 23, 2004SMS3000BOX2LB
Mobile Sempron 3100+1800 MHz256 kB800 MHz9x0.975 - 1.25 V25 WJanuary 2005SMS3100BOX3LB

"Albany" (Socket 754, E6, 90 nm, Desktop replacement)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit

Model NumberFrequencyL2 CacheHyperTransportMult.2VoltageTDPRelease DatePart Number(s)
Mobile Sempron 3000+1800 MHz128 kB800 MHz9x0.95 - 1.4 V62 WJuly 15, 2005SMN3000BIX2BX
Mobile Sempron 3100+1800 MHz256 kB800 MHz9x0.95 - 1.4 V62 WJuly 15, 2005SMN3100BIX3BX
Mobile Sempron 3300+2000 MHz128 kB800 MHz10x0.95 - 1.4 V62 WJuly 15, 2005SMN3300BIX2BX
Mobile Sempron 3400+2000 MHz256 kB800 MHz10x0.95 - 1.4 V62 WJanuary 23, 2006SMN3400BIX3BX
Mobile Sempron 3600+2200 MHz128 kB800 MHz11x0.95 - 1.4 V62 WMay 17, 2006SMN3600BIX2BX

"Roma" (Socket 754, E6, 90 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit

Model NumberFrequencyL2 CacheHyperTransportMult.2VoltageTDPRelease DatePart Number(s)
Mobile Sempron 2800+1600 MHz256 kB800 MHz8x0.95 - 1.2 V25 WJuly 15, 2005SMS2800BQX3LF
Mobile Sempron 3000+1800 MHz128 kB800 MHz9x0.95 - 1.2 V25 WJuly 15, 2005SMS3000BQX2LE
SMS3000BQX2LF
Mobile Sempron 3100+1800 MHz256 kB800 MHz9x0.95 - 1.2 V25 WJuly 15, 2005SMS3100BQX3LE
Mobile Sempron 3300+2000 MHz128 kB800 MHz10x0.95 - 1.2 V25 WJuly 2005SMS3300BQX2LE
Mobile Sempron 3400+2000 MHz256 kB800 MHz10x0.95 - 1.2 V25 WMay 17, 2006SMS3400BQX3LE

Mobile Athlon 64

"ClawHammer" (C0 & CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model NumberFrequencyL2 CacheHTMult.1VCoreTDPSocketRelease DatePart Number(s)
Mobile Athlon 64 2700+1600 MHz512 kB800 MHz8x1.50 V19 - 81.5 WSocket 754May 2004AMA2700BEY4AP (C0)
Mobile Athlon 64 2800+1600 MHz1024 kB800 MHz8x1.50 V19 - 81.5 WSocket 754February 2004AMA2800BEX5AP (C0)
AMA2800BEX5AR (CG)
Mobile Athlon 64 3000+1800 MHz1024 kB800 MHz9x1.50 V19 - 81.5 WSocket 754September 2003AMA3000BEX5AP (C0)
AMA3000BEX5AR (CG)
Mobile Athlon 64 3200+2000 MHz1024 kB800 MHz10x1.50 V19 - 81.5 WSocket 754September 2003AMA3200BEX5AP (C0)
AMA3200BEX5AR (CG)
Mobile Athlon 64 3400+2200 MHz1024 kB800 MHz11x1.50 V19 - 81.5 WSocket 754September 2003AMA3400BEX5AP (C0)
AMA3400BEX5AR (CG)
Mobile Athlon 64 3700+2400 MHz1024 kB800 MHz12x1.50 V19 - 81.5 WSocket 754September 2003AMA3700BEX5AP (C0)
AMA3700BEX5AR (CG)

"ClawHammer" (C0 & CG, 130 nm, 62 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model NumberFrequencyL2 CacheHTMult.1VCoreTDPSocketRelease DatePart Number(s)
Mobile Athlon 64 2800+1600 MHz1024 kB800 MHz8x1.40 V62 WSocket 754September 2003AMN2800BIX5AP (C0)
AMN2800BIX5AR (CG)
Mobile Athlon 64 3000+1800 MHz1024 kB800 MHz9x1.40 V62 WSocket 754September 2003AMN3000BIX5AP (C0)
AMN3000BIX5AR (CG)
Mobile Athlon 64 3200+2000 MHz1024 kB800 MHz10x1.40 V62 WSocket 754September 2003AMN3200BIX5AP (C0)
AMN3200BIX5AR (CG)
Mobile Athlon 64 3400+2200 MHz1024 kB800 MHz11x1.40 V62 WSocket 754February 2004AMN3400BIX5AR (CG)

"ClawHammer" (CG, 130 nm, 35 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model NumberFrequencyL2 CacheHTMult.1VCoreTDPSocketRelease DatePart Number(s)
Mobile Athlon 64 2700+1600 MHz512 kB800 MHz8x1.20 V35 WSocket 754May 2004AMD2700BQX4AR

"Odessa" (CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model NumberFrequencyL2 CacheHTMult.1VCoreTDPSocketRelease DatePart Number(s)
Mobile Athlon 64 2800+1800 MHz512 kB800 MHz8x1.50 V19 - 81.5 WSocket 754April 2004AMA2800BEX4AX

"Odessa" (CG, 130 nm, 35 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model NumberFrequencyL2 CacheHTMult.1VCoreTDPSocketRelease DatePart Number(s)
Mobile Athlon 64 2700+1600 MHz512 kB800 MHz1.20 V35 WSocket 754May 2004AMD2700BQX4AX
Mobile Athlon 64 2800+1800 MHz512 kB800 MHz1.20 V35 WSocket 754May 2004AMD2800BQX4AX
Mobile Athlon 64 3000+2000 MHz512 kB800 MHz10×1.20 V35 WSocket 754May 2004AMD3000BQX4AX

"Oakville" (D0, 90 nm, 35 W TDP Low Power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model NumberFrequencyL2 CacheHTMult.1VCoreTDPSocketRelease DatePart Number(s)
Mobile Athlon 64 2700+1600 MHz512 kB800 MHz1.35 V35 WSocket 754August 17, 2004AMD2700BKX4LB
Mobile Athlon 64 2800+1800 MHz512 kB800 MHz1.35 V35 WSocket 754August 17, 2004AMD2800BKX4LB
Mobile Athlon 64 3000+2000 MHz512 kB800 MHz10×1.35 V35 WSocket 754August 17, 2004AMD3000BKX4LB

"Newark" (E5, 90 nm, 62 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model NumberFrequencyL2 CacheHTMult.1VCoreTDPSocketRelease DatePart Number(s)
Mobile Athlon 64 3000+1800 MHz1024 kB800 MHz1.35 V62 WSocket 754April 14, 2005AMN3000BKX5BU
Mobile Athlon 64 3200+2000 MHz1024 kB800 MHz10×1.35 V62 WSocket 754April 14, 2005AMN3200BKX5BU
Mobile Athlon 64 3400+2200 MHz1024 kB800 MHz11×1.35 V62 WSocket 754April 14, 2005AMN3400BKX5BU
Mobile Athlon 64 3700+2400 MHz1024 kB800 MHz12×1.35 V62 WSocket 754April 14, 2005AMN3700BKX5BU
Mobile Athlon 64 4000+2600 MHz1024 kB800 MHz13×1.35 V62 WSocket 754August 16, 2005AMN4000BKX5BU

Turion 64

"Lancaster" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model NumberFrequencyL2 CacheHTMult.1VoltageTDPSocketRelease dateOrder Part Number
Turion 64 ML-281600 MHz512 kB800 MHz8x1.35 V35 WSocket 754June 22, 2005TMDML28BKX4LD
Turion 64 ML-301600 MHz1024 kB800 MHz8x1.35 V35 WSocket 754March 10, 2005TMDML30BKX5LD
Turion 64 ML-321800 MHz512 kB800 MHz9x1.35 V35 WSocket 754March 10, 2005TMDML32BKX4LD
Turion 64 ML-341800 MHz1024 kB800 MHz9x1.35 V35 WSocket 754March 10, 2005TMDML34BKX5LD
Turion 64 ML-372000 MHz1024 kB800 MHz10x1.35 V35 WSocket 754March 10, 2005TMDML37BKX5LD
Turion 64 ML-402200 MHz1024 kB800 MHz11x1.35 V35 WSocket 754June 22, 2005TMDML40BKX5LD
Turion 64 ML-422400 MHz512 kB800 MHz12x1.35 V35 WSocket 754October 4, 2005TMDML42BKX4LD
Turion 64 ML-442400 MHz1024 kB800 MHz12x1.35 V35 WSocket 754January 4, 2006TMDML44BKX5LD
Turion 64 MT-281600 MHz512 kB800 MHz8x1.20 V25 WSocket 754June 22, 2005TMSMT28BQX4LD
Turion 64 MT-301600 MHz1024 kB800 MHz8x1.20 V25 WSocket 754March 10, 2005TMSMT30BQX5LD
Turion 64 MT-321800 MHz512 kB800 MHz9x1.20 V25 WSocket 754March 10, 2005TMSMT32BQX4LD
Turion 64 MT-341800 MHz1024 kB800 MHz9x1.20 V25 WSocket 754March 10, 2005TMSMT34BQX5LD
Turion 64 MT-372000 MHz1024 kB800 MHz10x1.20 V25 WSocket 754August 8, 2005TMSMT37BQX5LD
Turion 64 MT-402200 MHz1024 kB800 MHz11x1.20 V25 WSocket 754August 8, 2005TMSMT40BQX5LD

Kite platform (2006)

Introduced in 2006, the Kite platform consists of:

AMD mobile Kite platform
Mobile processor Processors - Socket S1
  • Mobile Sempron single-core 64-bit processor (codenamed Keene), or
  • Turion 64 single-core 64-bit processor (codenamed Richmond), or
  • Turion 64 X2 dual-core 64-bit processor (codenamed Taylor, Trinidad)
Mobile chipset
Mobile support

Mobile Sempron

"Keene" (Socket S1, F2, 90 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model NumberFrequencyL2 CacheHyperTransportMult.2VoltageTDPRelease DatePart Number(s)
Mobile Sempron 3200+1600 MHz512 kB800 MHz8x0.950 - 1.125 V25 WMay 17, 2006SMS3200HAX4CM
Mobile Sempron 3400+1800 MHz256 kB800 MHz9x0.950 - 1.125 V25 WMay 17, 2006SMS3400HAX3CM
Mobile Sempron 3500+1800 MHz512 kB800 MHz9x0.950 - 1.125 V25 WMay 17, 2006SMS3500HAX4CM
Mobile Sempron 3600+2000 MHz256 kB800 MHz10x0.950 - 1.125 V25 WOct 23, 2006SMS3600HAX3CM

Turion 64

"Richmond" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model NumberFrequencyL2 CacheHTMult.1VoltageTDPSocketRelease dateOrder Part Number
Turion 64 MK-362000 MHz512 kB800 MHz10x1.15 V31 WSocket S1September 1, 2006TMDMK36HAX4CM
Turion 64 MK-382200 MHz512 kB800 MHz11x1.15 V31 WSocket S1Q1 2007TMDMK38HAX4CM

Turion 64 X2

"Taylor" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model NumberFrequencyL2 CacheHTMult.1VoltageTDPSocketRelease dateOrder Part Number
Turion 64 X2 TL-501600 MHz2 × 256 kB800 MHz8x0.8 - 1.10 V31 WSocket S1May 17, 2006TMDTL50HAX4CT

"Trinidad" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model NumberFrequencyL2 CacheHTMult.1VoltageTDPSocketRelease dateOrder Part Number
Turion 64 X2 TL-521600 MHz2 × 512 kB800 MHz8x0.8 - 1.125 V31 WSocket S1May 17, 2006TMDTL52HAX5CT
Turion 64 X2 TL-561800 MHz2 × 512 kB800 MHz9x0.8 - 1.125 V33 WSocket S1May 17, 2006TMDTL56HAX5CT
Turion 64 X2 TL-602000 MHz2 × 512 kB800 MHz10x0.8 - 1.125 V35 WSocket S1May 17, 2006TMDTL60HAX5CT
Turion 64 X2 TL-642200 MHz2 × 512 kB800 MHz11x0.8 - 1.125 V35 WSocket S1January 30, 2007TMDTL64HAX5CT

Kite Refresh platform (2007)

AMD used Kite Refresh as the codenamed for the second-generation AMD mobile platform introduced in February 2007.

AMD mobile Kite Refresh platform
Mobile processor Processors - Socket S1
  • Turion 64 X2 dual-core 64-bit Hawk family processor 65 nm (codenamed Tyler), or
  • Mobile Sempron single-core 64-bit processor 65 nm (codenamed Sherman)
Mobile chipset
  • HDMI, HyperTransport 1.0 and PCI Express 1.0
  • DDR2-800 SO-DIMM
Mobile support

Mobile Sempron

"Sherman" (Socket S1, G1 & G2, 65 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64

Model NumberFrequencyL2 CacheHyperTransportMult.2VoltageTDPRelease DatePart Number(s)
Sempron 2100+ fanless[1]1000 MHz256 kB800 MHz5x0.950 - 1.125 V9 WMay 30, 2007SMF2100HAX3DQE (G1)
Mobile Sempron 3600+2000 MHz256 kB800 MHz10x25 WSMS3600HAX3DN (G2)
Mobile Sempron 3700+2000 MHz512 kB800 MHz10x25 WSMS3700HAX4DQE (G1)
Mobile Sempron 3800+2200 MHz256 kB800 MHz11x31 WSMD3800HAX3DN (G2)
Mobile Sempron 4000+2200 MHz512 kB800 MHz11x31 WSMD4000HAX4DN (G2)

Athlon 64 X2

"Tyler" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model NumberFrequencyL2 CacheHTMult.1VoltageTDPSocketRelease dateOrder Part Number
Athlon 64 X2 TK-421600 MHz2 × 512 kB800 MHz8.0x1.075/1.10/1.125 V20 WSocket S1AMETK42HAX5DM
Athlon 64 X2 TK-531700 MHz2 × 256 kB800 MHz8.5x1.075/1.10/1.125 V31 WSocket S1August 20, 2007AMDTK53HAX4DC
Athlon 64 X2 TK-551800 MHz2 × 256 kB800 MHz9.0x1.075/1.10/1.125 V31 WSocket S1Aug 20 2007AMDTK55HAX4DC
Athlon 64 X2 TK-571900 MHz2 × 256 kB800 MHz9.5x1.075/1.10/1.125 V31 WSocket S12008AMDTK57HAX4DM

Turion 64 X2

"Tyler" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model NumberFrequencyL2 CacheHTMult.1VoltageTDPSocketRelease dateOrder Part Number
Turion 64 X2 TL-561800 MHz2 × 512 kB800 MHz9.0x1.075/1.10/1.125 V31 WSocket S1May 7, 2007TMDTL56HAX5DC
Turion 64 X2 TL-581900 MHz2 × 512 kB800 MHz9.5x1.075/1.10/1.125 V31 WSocket S1May 7, 2007TMDTL58HAX5DC
Turion 64 X2 TL-602000 MHz2 × 512 kB800 MHz10.0x1.075/1.10/1.125 V31 WSocket S1May 7, 2007TMDTL60HAX5DC
Turion 64 X2 TL-622100 MHz2 × 512 kB800 MHz10.5x1.075/1.10/1.125 V35 WSocket S1Jan 21 2008TMDTL62HAX5DM
Turion 64 X2 TL-642200 MHz2 × 512 kB800 MHz11.0x1.075/1.10/1.125 V35 WSocket S1May 7, 2007TMDTL64HAX5DC
Turion 64 X2 TL-662300 MHz2 × 512 kB800 MHz11.5x1.075/1.10/1.125 V35 WSocket S1May 7, 2007
Jul 10 2007
TMDTL66HAX5DC
TMDTL66HAX5DM
Turion 64 X2 TL-682400 MHz2 × 512 kB800 MHz12.0x1.075/1.10/1.125 V35 WSocket S1December 19, 2007TMDTL68HAX5DM

Puma platform (2008)

The Puma platform introduced in 2008 with June 2008 availability for the third-generation AMD mobile platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Dual-core 64-bit codenamed Griffin of processors, named "Turion X2 Ultra", or
  • Mobile Sempron single-core 64-bit processor (codenamed Sable), with the following:
    • Split-power planes and linked power management support
    • Support for possible low voltage processors
Mobile chipset AMD M780 series chipset
Mobile support
  • Wireless IEEE 802.11 a/b/g/n mini-PCIe Wi-Fi adapter
  • Hybrid hard drives
  • Desktop and mobile Architecture for System Hardware (DASH) 1.0 support (DASH page)
  • Trusted Platform Module (TPM) support

Mobile Sempron

"Sable" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model NumberFrequencyL2 CacheHTMult.1VoltageTDPSocketRelease dateOrder Part Number
Sempron SI-402000 MHz512 kB1800 MHz10.0x1.075 - 1.125 V25 WSocket S1G2June 4, 2008SMSI40SAM12GG
Sempron SI-422100 MHz512 kB1800 MHz10.5x1.075 - 1.125 V25 WSocket S1G2Q3 2008SMSI42SAM12GG

Athlon X2

"Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model NumberFrequencyL2 CacheHTMult.1VoltageTDPSocketRelease dateOrder Part Number
Athlon X2 QL-601900 MHz2 × 512 kB1800 MHz9.5x0.95 - 1.1 V35 WSocket S1G2June 4, 2008AMQL60DAM22GG
Athlon X2 QL-622000 MHz2 × 512 kB1800 MHz10.0x0.95 - 1.1 V35 WSocket S1G2Q3 2008AMQL62DAM22GG
Athlon X2 QL-642100 MHz2 × 512 kB1800 MHz10.5x0.95 - 1.1 V35 WSocket S1G2Q4 2008AMQL64DAM22GG
Athlon X2 QL-652100 MHz2 × 512 kB2000 MHz10.5x0.95 - 1.1 V35 WSocket S1G2Q4 2008AMQL65DAM22GG
Athlon X2 QL-662200 MHz2 × 512 kB1800 MHz11.0x0.95 - 1.1 V35 WSocket S1G2Q4 2008AMQL66DAM22GG
Athlon X2 QL-672200 MHz2 × 512 kB2000 MHz11.0x0.95 - 1.1 V35 WSocket S1G2Q4 2008AMQL67DAM22GG

Turion X2

"Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model NumberFrequencyL2 CacheHTMult.1VoltageTDPSocketRelease dateOrder Part Number
Turion X2 RM-70[2]2000 MHz2 × 512 kB1800 MHz10x0.75 - 1.2 V31 WSocket S1G2June 4, 2008TMRM70DAM22GG
Turion X2 RM-72[2]2100 MHz2 × 512 kB1800 MHz10.5x0.75 - 1.2 V35 WSocket S1G2Q3 2008TMRM72DAM22GG
Turion X2 RM-74[2]2200 MHz2 × 512 kB1800 MHz11.0x0.75 - 1.2 V35 WSocket S1G2Q4 2008TMRM74DAM22GG
Turion X2 RM-75[2]2200 MHz2 × 512 kB2000 MHz11.0x0.75 - 1.2 V35 WSocket S1G2Q4 2008TMRM75DAM22GG
Turion X2 RM-76[2]2300 MHz2 × 512 kB1800 MHz11.5x0.75 - 1.2 V35 WSocket S1G2Q4 2008TMRM76DAM22GG
Turion X2 RM-77[2]2300 MHz2 × 512 kB2000 MHz11.5x0.75 - 1.2 V35 WSocket S1G2Q4 2008TMRM77DAM22GG

Turion X2 Ultra

"Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model NumberFrequencyL2 CacheHTMult.1VoltageTDPSocketRelease dateOrder Part Number
Turion X2 Ultra ZM-80[2]2100 MHz2 × 1 MB1800 MHz10.5x0.75 - 1.2 V32 WSocket S1G2June 4, 2008TMZM80DAM23GG
Turion X2 Ultra ZM-82[2]2200 MHz2 × 1 MB1800 MHz11.0x0.75 - 1.2 V35 WSocket S1G2June 4, 2008TMZM82DAM23GG
Turion X2 Ultra ZM-84[2]2300 MHz2 × 1 MB1800 MHz11.5x0.75 - 1.2 V35 WSocket S1G2Q3 2008TMZM84DAM23GG
Turion X2 Ultra ZM-85[2]2300 MHz2 × 1 MB2200 MHz11.5x0.75 - 1.2 V35 WSocket S1G2Q3 2008TMZM85DAM23GG
Turion X2 Ultra ZM-86[2]2400 MHz2 × 1 MB1800 MHz12.0x0.75 - 1.2 V35 WSocket S1G2June 4, 2008TMZM86DAM23GG
Turion X2 Ultra ZM-87[2]2400 MHz2 × 1 MB2200 MHz12.0x0.75 - 1.2 V35 WSocket S1G2Q3 2008TMZM87DAM23GG
Turion X2 Ultra ZM-88[2]2500 MHz2 × 1 MB1800 MHz12.5x0.75 - 1.2 V35 WSocket S1G2Q3 2008TMZM88DAM23GG

Yukon platform (2009)

The Yukon platform was introduced on January 8, 2009, with expected April availability for the first AMD Ultrathin Platform targeting the ultra-portable notebook market.

AMD mobile Initial platform
Mobile processor Processors
  • Single-core 64-bit codenamed Huron of processors, named "Athlon Neo", or
  • Mobile Sempron single-core 64-bit processor (codenamed Huron), with the following:
    • 27 mm (W) × 27 mm (D) × 2.5 mm (H) BGA package, named "ASB1"
    • low voltage processors
Mobile chipset AMD RS690E series chipset + SB600 southbridge
Mobile support
  • Wireless connectivity with 3G (as option)
  • Wireless IEEE 802.11 a/b/g/n mini-PCIe Wi-Fi adapter

Sempron

"Huron" (65 nm, Low power)

  • Both models support: MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64
  • Sempron 210U supports extra AMD-V
Model NumberFrequencyL2 CacheHTMult.1VoltageTDPPackage/SocketRelease dateOrder Part Number
Sempron 200U[3]1000 MHz256 kB1600 MHz5x0.925 V8 WSocket ASB1January 8, 2009SMF200UOAX3DV
Sempron 210U1500 MHz256 kB1600 MHz7.5x0.925 V15 WSocket ASB1January 8, 2009SMG210UOAX3DX

Athlon Neo

"Huron" (65 nm, 15 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!, AMD-V[4]

Model NumberFrequencyL2 CacheHTMult.1VCoreTDPPackageRelease DatePart Number(s)
Athlon Neo MV-401600 MHz512 kB800 MHz8x1.1 V15 WSocket ASB1January 8, 2009AMGMV40OAX4DX

"Sherman" (65 nm, 15 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model NumberFrequencyL2 CacheHTMult.1VCoreTDPPackageRelease DatePart Number(s)
Athlon Neo TF-201600 MHz512 kB800 MHz8x1.0 V15 WSocket S1January 8, 2009AMGTF20HAX4DN

"Congo" (65 nm, 13 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model NumberFrequencyL2 CacheHTMult.1VCoreTDPPackageRelease DatePart Number(s)
Athlon Mobile X2 L3101200 MHz2 × 512 kB800 MHz6x0.925 V13 WSocket S1January 8, 2009AMML310HAX5DM

Turion

"Congo" (65 nm, 20 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model NumberFrequencyL2 CacheHTMult.1VCoreTDPPackageRelease DatePart Number(s)
Turion Mobile X2 L5101600 MHz2 × 512 kB800 MHz8x0.925 V20 WSocket S1January 8, 2009TMEL510HAX5DM

Congo platform (2009)

The Congo platform [5] was introduced in September 2009, as the second AMD Ultrathin Platform targeting the ultra-portable notebook market.

AMD mobile Initial platform
Mobile processor Processors
  • Single or Dual-core 64-bit processors codenamed Conesus, with the following:
    • made on 65 nm process
    • 15 W (single-core) or 18 W (dual-core) TDP
    • 27 mm (W) × 27 mm (D) × 2.5 mm (H) BGA package, named "ASB1"
    • low voltage processors
    • DDR2 SO-DIMM
Mobile chipset AMD M780G(RS780M) series chipset + SB710 southbridge

Athlon Neo X2

"Conesus" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V

Model NumberFrequencyL2 CacheHTMult.1VoltageTDPSocketRelease dateOrder Part Number
Athlon Neo X2 L3251500 MHz2 × 512 kB800 MHz7.5x0.925 V18 WSocket ASB1August 10, 2009AMZL325OAX5DY
Athlon Neo X2 L3351600 MHz2 × 512 kB800 MHz8.0x0.925 V18 WSocket ASB1February 2010AMZL335OAX5DY

Turion Neo X2

"Conesus" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V, PowerNow!

Model NumberFrequencyL2 CacheHTMult.1VoltageTDPSocketRelease dateOrder Part Number
Turion Neo X2 L6251600 MHz2 × 512 kB800 MHz8x0.925 V18 WSocket ASB1August 10, 2009TMZL625OAX5DY

Tigris platform (2009)

The Tigris platform [6] introduced in September 2009 for the AMD Mainstream Notebook Platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Single or Dual-core 64-bit processors codenamed Caspian, with the following:
    • made on 45 nm process
    • 25 W (single-core) or 35 W (dual-core) TDP
Mobile chipset AMD M785(RS880M) series chipset + SB710 southbridge

Sempron

"Caspian" (45 nm)

Single-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model NumberFrequencyL2 CacheFPU width[6]HTMult.VoltageTDPSocketRelease dateOrder Part Number
Sempron M1002000 MHz512 kB64-bit1600 MHz10.0x25 WSocket S1G3September 10, 2009SMM100SBO12GQ
Sempron M1202100 MHz512 kB64-bit1600 MHz10.5x25 WSocket S1G3September 10, 2009SMM120SBO12GQ
Sempron M1402200 MHz512 kB64-bit1600 MHz10.5x25 WSocket S1G3April 2010SMM140SBO12GQ

Athlon II

"Caspian" (45 nm)

Dual-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model numberFrequencyL2 cacheFPU width[6]HTMult.TDPSocketRelease datePart number
Athlon II M3002.0 GHz2 × 512 kB64-bit1.6 GHz10×35 WSocket S1G3September 10, 2009AMM300DBO22GQ
Athlon II M3202.1 GHz2 × 512 kB64-bit1.6 GHz10.5×35 WSocket S1G3September 10, 2009AMM320DBO22GQ
Athlon II M3402.2 GHz2 × 512 kB64-bit1.6 GHz11×35 WSocket S1G3September 10, 2009AMM340DBO22GQ
Athlon II M3602.3 GHz2 × 512 kB64-bit1.6 GHz11×35 WSocket S1G3May 2010AMM360DBO22GQ

Turion II

"Caspian" (45 nm)

Dual-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model numberClock
speed
L2 cacheFPU width[6]Hyper
Transport
MultiTDPSocketRelease datePart number
Turion II M5002.2 GHz2 × 512 KB128-bit1.8 GHz11×35 WSocket S1G3September 10, 2009TMM500DBO22GQ
Turion II M5202.3 GHz2 × 512 KB128-bit1.8 GHz11.5×35 WSocket S1G3September 10, 2009TMM520DBO22GQ
Turion II M5402.4 GHz2 × 512 KB128-bit1.8 GHz12×35 WSocket S1G3September 10, 2009TMM540DBO22GQ
Turion II M5602.5 GHz2 × 512 KB128-bit1.8 GHz12×35 WSocket S1G3April 2010TMM560DBO22GQ

Turion II (Ultra)

"Caspian" (45 nm)

Dual-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model numberClock
speed
L2 cacheFPU width[6]Hyper
Transport
MultiTDPSocketRelease datePart number
Turion II Ultra M6002.4 GHz2 × 1 MB128-bit1.8 GHz12×35 WSocket S1G3September 10, 2009TMM600DBO23GQ
Turion II Ultra M6202.5 GHz2 × 1 MB128-bit1.8 GHz12.5×35 WSocket S1G3September 10, 2009TMM620DBO23GQ
Turion II Ultra M6402.6 GHz2 × 1 MB128-bit1.8 GHz13×35 WSocket S1G3September 10, 2009TMM640DBO23GQ
Turion II Ultra M6602.7 GHz2 × 1 MB128-bit1.8 GHz13.5×35 WSocket S1G3September 10, 2009TMM660DBO23GQ

Nile platform (2010)

The Nile platform [7][8] introduced on May 12, 2010, for the third AMD Ultrathin Platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Single or Dual-core 64-bit processors codenamed Geneva, with the following:
    • made on 45 nm process
    • support for DDR3 memory[9]
    • 9 W, 12 W or 15 W TDP
Mobile chipset AMD RS880 series chipset + SB850 southbridge
  • MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066)

V series

"Geneva" (45 nm)

Single-core mobile processor

Model
number
Clock
speed
L2 cacheFPU width[8]Hyper
Transport
MultiTDPSocketRelease datePart number
V1051.2 GHz512 KB64-bit1.0 GHz9 WASB2May 12, 2010VMV105FDV12GM

Athlon II Neo

"Geneva" (45 nm)

Single-core mobile processor Single-core mobile processor

Model numberFrequencyL2 CacheFPU width[10]HTMult.TDPSocketRelease dateOrder Part Number
Athlon II Neo K1251.7 GHz1 MB64-bit1.0 GHz8.5×12 WASB2May 12, 2010AMK125LAV13GM
Athlon II Neo K1451.8 GHz1 MB64-bit1.0 GHz12 WASB2January 4, 2011AMK145LAV13GM

Dual-core mobile processor

Model numberFrequencyL2 CacheFPU width[10]HTMult.TDPSocketRelease dateOrder Part Number
Athlon II Neo N36L1.3 GHz2 × 1 MB64-bit1.0 GHz6.5×12 WASB2April 26, 2010AEN36LLAV23GME
Athlon II Neo K3251.3 GHz2 × 1 MB64-bit1.0 GHz6.5×12 WASB2May 12, 2010AMK325LAV23GM
Athlon II Neo K3451.4 GHz2 × 1 MB64-bit1.0 GHz12 WASB2January 4, 2011AMK345LAV23GM

Turion II Neo

"Geneva" (45 nm)

Dual-core mobile processor

Model numberClock
speed
L2 cacheFPU width[10]Hyper
Transport
MultiTDPSocketRelease datePart number
Turion II Neo N40L1.5 GHz2 × 1 MB128-bit1.6 GHz7.5×15 WSocket ASB2April 26, 2010TEN40LGAV23GME
Turion II K6251.5 GHz2 × 1 MB128-bit1.6 GHz7.5×15 WSocket ASB2May 12, 2010TMK625GAV23GM
Turion II K6451.6 GHz2 × 1 MB128-bit1.6 GHz15 WSocket ASB2January 4, 2011TMK645GAV23GM
Turion II K6651.7 GHz2 × 1 MB128-bit1.6 GHz8.5×15 WSocket ASB2May 12, 2010TMK665GAV23GM
Turion II K6851.8 GHz2 × 1 MB128-bit1.6 GHz15 WSocket ASB2January 4, 2011TMK685GAV23GM
Turion II Neo N54L2.2 GHz2 × 1 MB128-bit1.6 GHz11×25 WSocket ASB2May 2010TEN54LSDV23GME

Danube platform (2010)

The Danube platform[7][10] introduced on May 12, 2010, for the AMD Mainstream Notebook Platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Single, Dual, Triple or Quad-core 64-bit processors codenamed Champlain, with the following:
    • made on 45 nm process
    • support for DDR3 memory[9]
    • 25, 35 or 45 W TDP
Mobile chipset AMD RS880 series chipset + SB850 southbridge
  • MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066 MHz)

V series

Champlain (45 nm)

Single-core mobile processor

Model
number
Clock
speed
L2 cacheFPU width[10]Hyper
Transport
MultiTDPSocketRelease datePart number
V1202.2 GHz512 KB64-bit1.6 GHz11×25 WS1G4May 12, 2010VMV120SGR12GM
V1402.3 GHz512 KB64-bit1.6 GHz11.5×25 WS1G4October 4, 2010VMV140SGR12GM
V1602.4 GHz512 KB64-bit1.6 GHz12×25 WS1G4January 4, 2011VMV160SGR12GM

Athlon II

Champlain (45 nm)

Dual-core mobile processor

Model NumberFrequencyL2 cacheFPU width[10]HTMult.TDPSocketRelease dateOrder Part Number
Athlon II P3202.1 GHz2 × 512 KB64-bit1.6 GHz10.5×25 WSocket S1G4May 12, 2010AMP320SGR22GM
Athlon II P3402.2 GHz2 × 512 KB64-bit1.6 GHz11×25 WSocket S1G4October 4, 2010AMP340SGR22GM
Athlon II P3602.3 GHz2 × 512 KB64-bit1.6 GHz11.5×25 WSocket S1G4January 4, 2011AMP360SGR22GM
Athlon II N3302.3 GHz2 × 512 KB64-bit1.6 GHz11.5×35 WSocket S1G4May 12, 2010AMN330DCR22GM
Athlon II N3502.4 GHz2 × 512 KB64-bit1.6 GHz12×35 WSocket S1G4October 4, 2010AMN350DCR22GM
Athlon II N3702.5 GHz2 × 512 KB64-bit1.6 GHz12.5×35 WSocket S1G4January 4, 2011AMN370DCR22GM

Turion II

Champlain (45 nm)

Dual-core mobile processor

Model numberClock
speed
L2 cacheFPU width[10]Hyper
Transport
MultiTDPSocketRelease datePart number
Turion II P5202.3 GHz2 × 1 MB128-bit1.8 GHz11.5×25 WSocket S1G4May 12, 2010TMP520SGR23GM
Turion II P5402.4 GHz2 × 1 MB128-bit1.8 GHz12×25 WSocket S1G4October 4, 2010TMP540SGR23GM
Turion II P5602.5 GHz2 × 1 MB128-bit1.8 GHz12.5×25 WSocket S1G4October 19, 2010TMP560SGR23GM
Turion II N5302.5 GHz2 × 1 MB128-bit1.8 GHz12.5×35 WSocket S1G4May 12, 2010TMN530DCR23GM
Turion II N5502.6 GHz2 × 1 MB128-bit1.8 GHz13×35 WSocket S1G4October 4, 2010TMN550DCR23GM
Turion II N5702.7 GHz2 × 1 MB128-bit1.8 GHz13.5×35 WSocket S1G4January 4, 2011TMN570DCR23GM

Phenom II

  • MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
  • Unlike desktop models, mobile Phenom II-based models do not have L3 cache
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1333 MHz)

Champlain (45 nm)

Dual-core mobile processor

Model numberClock
speed
L2 cacheFPU width[10]Hyper
Transport
MultiTDPSocketRelease datePart number
Phenom II P6502.6 GHz2 × 1 MB128-bit1.8 GHz13×25 WSocket S1G4October 19, 2010HMP650SGR23GM
Phenom II N6202.8 GHz2 × 1 MB128-bit1.8 GHz14×35 WSocket S1G4May 12, 2010HMN620DCR23GM
Phenom II N6402.9 GHz2 × 1 MB128-bit1.8 GHz14.5×35 WSocket S1G4October 4, 2010HMN640DCR23GM
Phenom II N6603.0 GHz2 × 1 MB128-bit1.8 GHz15×35 WSocket S1G4January 4, 2011HMN660DCR23GM
Phenom II X620 BE3.1 GHz2 × 1 MB128-bit1.8 GHz15.5×45 WSocket S1G4May 12, 2010HMX620HIR23GM
Phenom II X640 BE3.2 GHz2 × 1 MB128-bit1.8 GHz16×45 WSocket S1G4May 10, 2011HMX640HIR23GM

Triple-core mobile processors

Model numberClock
speed
L2 cacheFPU width[10]Hyper
Transport
MultiTDPSocketRelease datePart number
Phenom II P8201.8 GHz3 × 512 KB128-bit1.8 GHz25 WSocket S1G4May 12, 2010HMP820SGR32GM
Phenom II P8401.9 GHz3 × 512 KB128-bit1.8 GHz9.5×25 WSocket S1G4October 4, 2010HMP840SGR32GM
Phenom II P8602.0 GHz3 × 512 KB128-bit1.8 GHz10×25 WSocket S1G4October 4, 2010HMP860SGR32GM
Phenom II N8302.1 GHz3 × 512 KB128-bit1.8 GHz10.5×35 WSocket S1G4May 12, 2010HMN830DCR32GM
Phenom II N8502.2 GHz3 × 512 KB128-bit1.8 GHz11×35 WSocket S1G4October 4, 2010HMN850DCR32GM
Phenom II N8702.3 GHz3 × 512 KB128-bit1.8 GHz11.5×35 WSocket S1G4January 4, 2011HMN870DCR32GM

Quad-core mobile processors

Model numberClock
speed
L2 cacheFPU width[10]Hyper
Transport
MultiTDPSocketRelease datePart number
Phenom II P9201.6 GHz4 × 512 KB128-bit1.8 GHz25 WSocket S1G4May 12, 2010HMP920SGR42GM
Phenom II P9401.7 GHz4 × 512 KB128-bit1.8 GHz8.5×25 WSocket S1G4October 4, 2010HMP940SGR42GM
Phenom II P9601.8 GHz4 × 512 KB128-bit1.8 GHz25 WSocket S1G4October 19, 2010HMP960SGR42GM
Phenom II N9302.0 GHz4 × 512 KB128-bit1.8 GHz10×35 WSocket S1G4May 12, 2010HMN930DCR42GM
Phenom II N9502.1 GHz4 × 512 KB128-bit1.8 GHz10.5×35 WSocket S1G4October 4, 2010HMN950DCR42GM
Phenom II N9702.2 GHz4 × 512 KB128-bit1.8 GHz11×35 WSocket S1G4January 4, 2011HMN970DCR42GM
Phenom II X920 BE2.3 GHz4 × 512 KB128-bit1.8 GHz11.5×45 WSocket S1G4May 12, 2010HMX920HIR42GM
Phenom II X940 BE2.4 GHz4 × 512 KB128-bit1.8 GHz12×45 WSocket S1G4January 4, 2011HMX940HIR42GM

Brazos platform (2011)

AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt AMD APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. Both low-power APU versions feature two Bobcat x86 cores and fully support DirectX11, DirectCompute (Microsoft programming interface for GPU computing) and OpenCL (cross-platform programming interface standard for multi-core x86 and accelerated GPU computing). Both also include UVD dedicated hardware acceleration for HD video including 1080p resolutions.[11][12][13][14] This platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Single or Dual-core 64-bit AMD APU codenamed Ontario, Zacate and with the following:
    • Bobcat cores made on 40 nm CMOS process
    • support for DDR3 1066 or 1333 MHz (E-450) memory
    • 9 W or 18 W TDP
  • Radeon HD 6xxx GPU on 40 nm process
    • Cedar graphics core with 80 SP
    • DirectX 11
    • UVD 3
Mobile chipset

"Ontario" (40 nm)

Model NumberStep.CPUGPUMemory
Support
TDPReleasedPart NumberInfo
CoresFreq.TurboL2 CacheMult.VoltageModelConfigFreq.
C-30 B011.2 GHz512 kB12×1.25 - 1.35HD 625080:8:4276 MHzDDR3-10669 WJanuary 4, 2011CMC30AFPB12GT C-30
C-50 21.0 GHz2 × 512 kB10×1.05 - 1.35277 MHzCMC50AFPB22GT C-50
C-60 C01.33 GHzHD 6290276 - 400 MHzAugust 22, 2011CMC60AFPB22GV C-60

"Zacate" (40 nm)

  • SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Single-channel, up to 1066 MHz)
  • 2.5 GT/s UMI.
  • Config GPU are Unified shaders : Texture mapping units : Render output units
  • Socket FT1 (BGA-413)
Model NumberStep.CPUGPUMemory
Support
TDPReleasedPart NumberInfo
CoresFreq.TurboL2 CacheMult.VoltageModelConfigFreq.
E-240 B011.5 GHz512 kB15×1.175 - 1.35HD 631080:8:4500 MHzDDR3-106618 WJanuary 4, 2011EME240GBB12GT E-240
E-300 B021.3 GHz2 × 512 kB13×488 MHzAugust 22, 2011EME300GBB22GV E-300
E-350 B01.6 GHz16×1.25 - 1.35492 MHzJanuary 4, 2011EME350GBB22GT E-350
E-450 B01.65 GHz16.5×HD 6320508 – 600 MHzDDR3-1333August 22, 2011EME450GBB22GV E-450

Sabine (Fusion) platform (2011)

The Sabine platform[15] introduced on June 30, 2011, for the AMD Mainstream Notebook Platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Dual or Quad-core 64-bit AMD APU codenamed Llano, and with the following:
    • made on 32 nm process
    • support for DDR3 1600 MHz memory
    • 35 W or 45 W TDP
  • Radeon HD 6xxxG GPU on 32 nm process
    • Sumo graphics core with up to 400 SP
    • DirectX 11
    • UVD 3
Mobile chipset

"Llano" (32 nm)

  • SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V, Turbo Core
  • Memory support: 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
  • 2.5 GT/s UMI.
  • Transistors: 1.148 billion
  • Die size: 228 mm²
Model NumberStep.CPUGPUMemory
Support
TDPSocketRelease DatePart Number(s)
CoresFreq.TurboL2 CacheMult.VcoreModelConfig1Freq.
E2-3000M B021.8 GHz2.4 GHz2 × 512 kB18x0.9125 - 1.4125HD 6380G160:8:4400 MHzDDR3-133335 WFS1June 14, 2011EM3000DDX22GX
A4-3300M B021.9 GHz2.5 GHz2 × 1 MB19x0.9125 - 1.4125HD 6480G240:12:4444 MHzDDR3-133335 WFS1June 14, 2011AM3300DDX23GX
A4-3305M B021.9 GHz2.5 GHz2 × 512 kB19x0.8750 - 1.4125HD 6480G160:8:4593 MHzDDR3-133335 WFS1December 7, 2011AM3305DDX22GX
A4-3310MX B022.1 GHz2.5 GHz2 × 1 MB21x0.9125 - 1.4125HD 6480G240:12:4444 MHzDDR3-133335 WFS1June 14, 2011AM3310HLX23GX
A4-3320M B022.0 GHz2.6 GHz2 × 1 MB20x0.9125 - 1.4125HD 6480G240:12:4444 MHzDDR3-133335 WFS1December 7, 2011AM3320DDX23GX
A4-3330MX B022.2 GHz2.6 GHz2 × 1 MB22x0.9125 - 1.4125HD 6480G240:12:4444 MHzDDR3-160045 WFS1December 7, 2011AM3330HLX23GX
A6-3400M B041.4 GHz2.3 GHz4 × 1 MB14x0.9125 - 1.4125HD 6520G320:16:8400 MHzDDR3-133335 WFS1June 14, 2011AM3400DDX43GX
A6-3410MX B041.6 GHz2.3 GHz4 × 1 MB16x0.9125 - 1.4125HD 6520G320:16:8400 MHzDDR3-160045 WFS1June 14, 2011AM3410HLX43GX
A6-3420M B041.5 GHz2.4 GHz4 × 1 MB15x0.9125 - 1.4125HD 6520G320:16:8400 MHzDDR3-133335 WFS1December 7, 2011AM3420DDX43GX
A6-3430MX B041.7 GHz2.4 GHz4 × 1 MB17x0.9125 - 1.4125HD 6520G320:16:8400 MHzDDR3-160045 WFS1December 7, 2011AM3430HLX43GX
A8-3500M B041.5 GHz2.4 GHz4 × 1 MB15x0.9125 - 1.4125HD 6620G400:20:8444 MHzDDR3-133335 WFS1June 14, 2011AM3500DDX43GX
A8-3510MX B041.8 GHz2.5 GHz4 × 1 MB18x0.9125 - 1.4125HD 6620G400:20:8444 MHzDDR3-160045 WFS1June 14, 2011AM3510HLX43GX
A8-3520M B041.6 GHz2.5 GHz4 × 1 MB16x0.9125 - 1.4125HD 6620G400:20:8444 MHzDDR3-133335 WFS1December 7, 2011AM3520DDX43GX
A8-3530MX B041.9 GHz2.6 GHz4 × 1 MB19x0.9125 - 1.4125HD 6620G400:20:8444 MHzDDR3-160045 WFS1June 14, 2011AM3530HLX43GX
A8-3550MX B042.0 GHz2.7 GHz4 × 1 MB20x0.9125 - 1.4125HD 6620G400:20:8444 MHzDDR3-160045 WFS1December 7, 2011AM3550HLX43GX

1 Unified shaders : Texture mapping units : Render output units

Brazos 2.0 platform (2012)

AMD Ultrathin Platform introduced on June 6, 2012, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It will feature the 40 nm Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. This platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Dual-core 64-bit AMD APU codenamed Zacate and with the following:
    • Bobcat cores made on 40 nm CMOS process
    • support for DDR3 1333 MHz memory
    • 18 W TDP
  • Radeon HD 7xxx GPU on 40 nm process
    • Cedar graphics core with 80 SP
    • DirectX 11
    • UVD 3
Mobile chipset

"Ontario", "Zacate" (40 nm)

  • SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V
  • Single-channel DDR3 SDRAM, DDR3L SDRAM
  • 2.5 GT/s UMI.
  • Config GPU are Unified shaders : Texture mapping units : Render output units
  • Socket FT1 (BGA-413)
Model NumberStep.CPUGPUMemory
Support
TDPRelease DatePart Number
CoresFreq.TurboL2 CacheMult.VcoreModelConfigFreq.Turbo
C-70 C021.0 GHz1.33 GHz2 × 512 kB10×HD 729080:8:4276 MHz400 MHzDDR3-10669 WSeptember 27, 2012CMC70AFPB22GV
E1-1200 B01.4 GHz14×HD 7310500 MHz18 WJune 6, 2012EM1200GBB22GV
E2-1500 1.48 GHz529 MHzJanuary 7, 2013
E2-1800 1.7 GHz17×HD 7340523 MHz680 MHzDDR3-1333June 6, 2012EM1800GBB22GV
E2-2000 1.75 GHz538 MHz700 MHzJanuary 7, 2013

Comal (Fusion) platform (2012)

The Comal platform introduced on May 15, 2012, for the AMD Mainstream Notebook Platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Dual or Quad-core 64-bit AMD APU codenamed Trinity, and with the following:
    • Piledriver cores made on 32 nm process
    • support for DDR3 1600 MHz memory
    • 17 W, 25 W or 35 W TDP
  • Radeon HD 7xxxG GPU on 32 nm process
    • Devastator graphics core with up to 384 SP
    • DirectX 11
    • UVD 3.2
Mobile chipset

"Trinity" (2012, 32 nm)

Model NumberStep.CPUGPUMemory
Support
TDPSocketRelease DatePart Number(s)
CoresFreq.TurboL2 CacheMult.VcoreModelConfig1Freq.Turbo
standard power
A4-4300M B022.5 GHz3.0 GHz1 MB25×0.8125 - 1.3HD 7420G128:8:4480 MHz655 MHzDDR3-160035 WFS1r2May 2012AM4300DEC23HJ
A6-4400M B022.7 GHz3.2 GHz1 MB27×0.8125 - 1.3HD 7520G192:12:4496 MHz685 MHzDDR3-160035 WFS1r2May 15, 2012AM4400DEC23HJ
A8-4500M B041.9 GHz2.8 GHz2 × 2 MB19×0.8125 - 1.3HD 7640G256:16:8496 MHz685 MHzDDR3-160035 WFS1r2May 15, 2012AM4500DEC44HJ
A10-4600M B042.3 GHz3.2 GHz2 × 2 MB23×0.8125 - 1.3HD 7660G384:24:8496 MHz685 MHzDDR3-160035 WFS1r2May 15, 2012AM4600DEC44HJ
low power
A4-4355M B021.9 GHz2.4 GHz1 MB21×HD 7400G192:12:4327 MHz424 MHzDDR3-133317 WFP2September 27, 2012AM4355SHE23HJ
A6-4455M B022.1 GHz2.6 GHz2 MB21×0.775 - 1.15HD 7500G256:16:8327 MHz424 MHzDDR3-133317 WFP2May 15, 2012AM4455SHE24HJ
A8-4555M B041.6 GHz2.4 GHz2 × 2 MB16×HD 7600G384:24:8320 MHz424 MHzDDR3-133319 WFP2September 27, 2012AM4555SHE44HJ
A10-4655M B042.0 GHz2.8 GHz2 × 2 MB20×0.85 - 1.2HD 7620G384:24:8360 MHz496 MHzDDR3-133325 WFP2May 15, 2012AM4655SIE44HJ

1 Config GPU are Unified shaders : Texture mapping units : Render output units

"Richland" (2013, 32 nm)

  • Elite Performance APU.[16][17]
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, NX bit, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, CVT16, F16C, Turbo Core
  • Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
  • 2.5 GT/s UMI.
  • Transistors: 1.303 billion
  • Die size: 246 mm²
Model NumberStep.CPUGPUMemory
Support
TDPSocketRelease DatePart Number(s)
CoresFreq.TurboL2 CacheMult.VcoreModelConfigFreq.Turbo
standard power
A4-5150M 22.7 GHz3.3 GHz1 MBHD 8350G128:8:4533 MHz720 MHzDDR3-160035 WFS1r2Q1 2013AM5150DEC23HL
A6-5350M 2.9 GHz3.5 GHzHD 8450G192:12:4533 MHz720 MHzDDR3-1600FS1r2Q1 2013AM5350DEC23HL
A6-5357M 2.9 GHz3.5 GHzHD 8450G192533 MHz720 MHzDDR3L-1600FP2 (BGA)May 2013AM5357DFE23HL
A8-5550M 42.1 GHz3.1 GHz2 × 2 MBHD 8550G256:16:8515 MHz720 MHzDDR3-1600FS1r2Q1 2013AM5550DEC44HL
A8-5557M 2.1 GHz3.1 GHzHD 8550G256554 MHz720 MHzDDR3L-1600FP2 (BGA)May 2013AM5557DFE44HL
A10-5750M 2.5 GHz3.5 GHzHD 8650G384:24:8533 MHz720 MHzDDR3-1866FS1r2Q1 2013AM5750DEC44HL
A10-5757M 2.5 GHz3.5 GHzHD 8650G384600 MHz720 MHzDDR3L-1600FP2 (BGA)May 2013AM5757DFE44HL
low power
A4-5145M 22.0 GHz2.6 GHz1 MBHD 8310G128424 MHz554 MHzDDR3L-133317 WFP2 (BGA)May 2013AM5145SIE44HL?
A6-5345M 2.2 GHz2.8 GHzHD 8410G192450 MHz600 MHzDDR3L-1333May 2013AM5345SIE44HL?
A8-5545M 41.7 GHz2.7 GHz2 × 2 MBHD 8510G384450 MHz554 MHzDDR3L-133319 WMay 2013AM5545SIE44HL
A10-5745M 2.1 GHz2.9 GHzHD 8610G384533 MHz626 MHzDDR3L-133325 WMay 2013AM5745SIE44HL

1 Config GPU are Unified shaders : Texture mapping units : Render output units

Jaguar (2013)

AMD mobile Initial platform
Mobile processor Processors
  • Dual-core or quad-core 64-bit AMD APU codenamed Kabini, Temash and with the following:
    • Jaguar cores made on 28 nm CMOS process
    • support for Single-channel DDR3 SDRAM and DDR3L SDRAM 1600 MHz memory
    • 3.9 - 25 W TDP
  • Radeon HD 8xxx GPU on 28 nm process
  • Integrated FCH
  • SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, CLMUL, AES, F16C, ABM, BMI1, NX bit, AMD64, PowerNow!, AMD-V
  • Socket FT3 (BGA)
  • Turbo Dock Technology, C6 and CC6 low power states

"Temash" (2013, 28 nm)

Elite Mobility APU:

ModelStep.CPUGPUMemoryTDPReleasedPart Number
CoresFreq.TurboL2 CacheMult.1VcoreModelConfig1Freq.Turbo
A4-1200 B021.0 GHz1 MBHD 8180128:8:4225 MHzDDR3L-10663.9 WMay 2013AT1200IFJ23HM
A4-1250 HD 8210300 MHzDDR3L-13338 WMay 2013AT1250IDJ23HM
A6-1450 41.4 GHz2 MBHD 8250300 MHz400 MHzDDR3L-10668 WMay 2013AT1450IDJ44HM

1 Unified shaders : Texture mapping units : Render output units

"Kabini" (2013, 28 nm)

Mainstream APU:

ModelStep.CPUGPUMemoryTDPReleasedPart Number
CoresFreq.TurboL2 CacheMult.1VcoreModelConfig1Freq.Turbo
E1-2100 B021.0 GHz1 MBHD 8210128:8:4300 MHzDDR3L-13339 WMay 2013EM2100ICJ23HM
E1-2500 1.4 GHzHD 8240400 MHzDDR3L-133315 WMay 2013EM2500IBJ23HM
E2-3000 1.65 GHzHD 8280450 MHzDDR3L-160015 WMay 2013EM3000IBJ23HM
A4-5000 41.5 GHz2 MBHD 8330500 MHzDDR3L-160015 WMay 2013AM5000IBJ44HM
A6-5200 2.0 GHzHD 8400600 MHzDDR3L-160025 WMay 2013AM5200IAJ44HM

1 Unified shaders : Texture mapping units : Render output units

Puma (2014)

Mullins, Tablet/2-in-1 APU

ModelSteppingCPUGPUMemory
support
TDPReleasedPart number
CoresFrequencyTurboL2 CacheMulti1VcoreModelConfig2FrequencyTurbo
E1 Micro-6200T 21.0 GHz1.4 GHz1 MB0.50 - 1.40 VR2128:8:4300 MHzDDR3L-10663.95 WQ2 2014EM620TIWJ23JB
A4 Micro-6400T 41.0 GHz1.6 GHz2 MBR3350 MHzDDR3L-13334.5 WQ2 2014AM640TIVJ44JB
A10 Micro-6700T 1.2 GHz2.2 GHz2 MBR6500 MHzDDR3L-13334.5 WQ2 2014AM670TIVJ44JB

Beema, Notebook APU

ModelSteppingCPUGPUMemory
support
TDPReleasedPart number
CoresFrequencyTurboL2 CacheMulti1VcoreModelConfig2FrequencyTurbo
E1-6010 21.35 GHz1 MB0.50 - 1.40 VR2128:8:4350 MHzDDR3L-133310 WQ2 2014EM6010IUJ23JB
E2-6110 41.5 GHz2 MBR2500 MHzDDR3L-160015 WQ2 2014EM6110ITJ44JB
A4-6210 1.8 GHzR3600 MHzDDR3L-160015 WQ2 2014AM6210ITJ44JB
A6-6310 1.8 GHz2.4 GHzR4800 MHzDDR3L-186615 WQ2 2014AM6310ITJ44JB
A8-6410 2 GHz2.4 GHzR5800 MHzDDR3L-186615 WQ2 2014

AM6410ITJ44JB

Kaveri (2014)

Model numberCPUGPUMemory
support
TDPSocketReleasedPart number
CoresFrequencyTurboL2 CacheMultiVcoreModelConfigFrequencyTurbo
low power
A6-7000 22.2 GHz3.0 GHz1 MB22×R4192:12:4494 MHz533 MHzDDR3-133317WFP3June 2014AM7000ECH23JA
A6 Pro-7050B 553 MHzAM705BECH23JA
A8-7100 41.8 GHz3.0 GHz2× 2 MB18×R5256:16:4450 MHz514 MHzDDR3-160019WFP3June 2014AM7100ECH44JA
A8 Pro-7150B 1.9 GHz3.2 GHz19×553 MHzAM715BECH44JA
A10-7300 1.9 GHz3.2 GHz19×R6384:24:8464 MHz533 MHzAM7300ECH44JA
A10 Pro-7350B 2.1 GHz3.3 GHz21×553 MHzAM735BECH44JA
FX-7500 2.1 GHz3.3 GHz21×R7384:24:8498 MHz533 MHzFM7500ECH44JA
standard power
A8-7200P 42.4 GHz3.3 GHz2× 2 MB24×R5256:16:4553 MHz626 MHzDDR3-186635WFP3June 2014AM740PDGH44JA
A10-7400P 2.5 GHz3.4 GHz25×R6384:24:8576 MHz654 MHzAM740PDGH44JA
FX-7600P 2.7 GHz3.6 GHz27×R7512:32:8600 MHz686 MHzDDR3-2133FM760PDGH44JA

Carrizo-L (2015)

ModelSteppingCPUGPUMemory
support
TDPReleasedPart number
CoresFrequencyTurboL2 CacheMulti1VcoreModelConfig2FrequencyTurbo
E1-7010 21.5 GHz1 MB0.50 - 1.40 VR2128:8:4400 MHzDDR3L-133310 WMay 2015EM7010IUJ23JB
E2-7110 41.8 GHz2 MBR2600 MHzDDR3L-160012-25 WMay 2015EM7110ITJ44JB
A4-7210 1.8 GHz2.2 GHzR3686 MHzDDR3L-160012-25 WMay 2015AM7210ITJ44JB
A6-7310 2.0 GHz2.4 GHzR4800 MHzDDR3L-186612-25 WMay 2015AM7310ITJ44JB
A8-7410 2.2 GHz2.5 GHzR5847 MHzDDR3L-186612-25 WMay 2015AM7410ITJ44JB

Carrizo (2015)

Model numberCPUGPUMemory
support
TDPSocketReleasedPart number
CoresFrequencyTurboL2 CacheMultiVcoreModelConfigFrequencyTurbo
standard power and low power (configurable TDP)
A6-8500P 21.6 GHz3.0 GHz1 MB16×R5256:16:4800 MHzDDR3-160012-35WFP4June 2015AM850PAAY23KA
A6 PRO-8500B 800 MHzAM850BAAY23KA
A8-8600P 41.6 GHz3.0 GHz2× 1 MB16×R6384:24:8720 MHzDDR3-213312-35WFP4June 2015AM860PAAY43KA
A8 PRO-8600B 1.6 GHz3.0 GHz16×720 MHzAM860BAAY43KA
A10-8700P 1.8 GHz3.2 GHz18×R6384:24:8800 MHzAM870PAAY43KA
A10 Pro-8700B 1.8 GHz3.2 GHz18×800 MHzAM870BAAY43KA
FX-8800P 2.1 GHz3.4 GHz21×R7512:32:8800 MHzFM880PAAY43KA
A12 Pro-8800B 2.1 GHz3.4 GHz21×800 MHzFM880BAAY43KA

Bristol Ridge (2016)

Model numberCPUGPUMemory
support
TDPSocketReleasedPart number
CoresFrequencyTurboL2 CacheMultiVcoreModelConfigFrequencyTurbo
standard power and low power (configurable TDP)
A10-9600P 42.4 GHz3.3 GHz2× 1 MBR5384:24:8720 MHzDDR4-186612–15WFP4June 2016AM960PADY44AB
A10-9600B PRO October 2016AM960BADY44AB
A10-9630P 2.6 GHz3.3 GHz800 MHzDDR4-240025–45WJune 2016AM963PAEY44AB
A10-9630B PRO October 2016AM963BAEY44AB
A12-9700P 2.5 GHz3.4 GHzR7384:24:8758 MHzDDR4-186612–15WJune 2016AM970PADY44AB
A12-9700B PRO DDR4-1866October 2016AM970BADY44AB
A12-9730P 2.8 GHz3.5 GHz900 MHzDDR4-240025–45WJune 2016AM973PAEY44AB
A12-9730B PRO October 2016AM973BAEY44AB
FX-9800P 2.7 GHz3.6 GHz512:32:8758 MHzDDR4-186612–15WJune 2016FM980PADY44AB
A12-9800B PRO October 2016AM980BADY44AB
FX-9830P 3.0 GHz3.7 GHz900 MHzDDR4-240025–45WJune 2016FM983PAEY44AB
A12-9830B PRO October 2016AM983BAEY44AB

"Raven Ridge" (2017)

Model Release
date
Fab CPU GPU Socket PCIe
lanes
Memory
support
TDP
Cores
(threads)
Clock rate (GHz) Cache Model Config[lower-roman 1] Clock
(MHz)
Processing
power
(GFLOPS)[lower-roman 2]
Base Boost L1 L2 L3
Athlon Pro 200U 2019 GloFo
14LP
2 (4) 2.3 3.2 64 KB inst.
32 KB data
per core
512 KB
per core
4 MB Radeon Vega 3 192:12:4
3 CU
1000 384 FP5 12 (8+4) DDR4-2400
dual-channel
1225 W
Athlon 300U Jan 6, 2019 2.4 3.3
Ryzen 3 2200U Jan 8, 2018 2.5 3.4 1100 422.4
Ryzen 3 3200U Jan 6, 2019 2.6 3.5 1200 460.8
Ryzen 3 2300U Jan 8, 2018 4 (4) 2.0 3.4 Radeon Vega 6 384:24:8
6 CU
1100 844.8
Ryzen 3 Pro 2300U May 15, 2018
Ryzen 5 2500U Oct 26, 2017 4 (8) 3.6 Radeon Vega 8 512:32:16
8 CU
1126.4
Ryzen 5 Pro 2500U May 15, 2018
Ryzen 5 2600H Sep 10, 2018 3.2 DDR4-3200
dual-channel
3554 W
Ryzen 7 2700U Oct 26, 2017 2.2 3.8 Radeon RX Vega 10 640:40:16
10 CU
1300 1664 DDR4-2400
dual-channel
1225 W
Ryzen 7 Pro 2700U May 15, 2018 Radeon Vega 10
Ryzen 7 2800H Sep 10, 2018 3.3 Radeon RX Vega 11 704:44:16
11 CU
1830.4 DDR4-3200
dual-channel
3554 W
  1. Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Picasso" (2019)

Common features of Ryzen 3000 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[lower-roman 1]
Model Clock
(GHz)
Config[lower-roman 2] Processing
power
(GFLOPS)[lower-roman 3]
Base Boost
Ryzen 7 3780U[18] 4 (8) 2.3 4.0 4 MB 1 × 4 RX Vega 11 1.4 704:44:16
11 CU
1971.2 15 W Oct 2019
3750H[19] RX Vega 10 640:40:16
10 CU[20]
1792.0 35 W Jan 6, 2019
3700C[21] 15 W Sep 22, 2020
3700U[lower-alpha 1][22] Jan 6, 2019
Ryzen 5 3580U[23] 2.1 3.7 Vega 9 1.3 576:36:16
9 CU
1497.6 Oct 2019
3550H[24] Vega 8 1.2 512:32:16
8 CU[25]
1228.8 35 W Jan 6, 2019
3500C[26] 15 W Sep 22, 2020
3500U[lower-alpha 1][27] Jan 6, 2019
3450U[28] 3.5 Jun 2020
Ryzen 3 3350U[29] 4 (4) Vega 6 384:24:8
6 CU[30]
921.6 Jan 6, 2019
3300U[lower-alpha 1][31] Jan 6, 2019
  1. Core Complexes (CCX) × cores per CCX
  2. Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. 1 2 3 Model also available as PRO version[lower-alpha 2][lower-alpha 3][lower-alpha 4], released April 8, 2019.
  2. "AMD Ryzen 3 PRO 3300U Mobile Processor with Radeon Vega 6 Graphics".
  3. "AMD Ryzen 5 PRO 3500U Mobile Processor with Radeon Vega 8 Graphics".
  4. "AMD Ryzen 7 PRO 3700U Mobile Processor with Radeon Vega 10 Graphics".

"Renoir" (2020)

U

Branding and model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[lower-roman 1]
Model Clock
(MHz)
Config[lower-roman 2] Processing
power
(GFLOPS)[lower-roman 3]
Base Boost
Ryzen 7 4980U 8 (16) 2.0 4.4 8 MB 2 × 4 Radeon
Graphics[lower-alpha 1]
1950 512:32:8
8 CU
1996.8 15 W Apr 13, 2021
4800U 1.8 4.2 1750 1792 Mar 16, 2020
Pro 4750U 1.7 4.1 1600 448:28:8
7 CU
1433.6 May 7, 2020
4700U 8 (8) 2.0 Mar 16, 2020
Ryzen 5 4680U 6 (12) 2.1 4.0 2 × 3 1500 1344 Apr 13, 2021
Pro 4650U 384:24:8
6 CU
1152 May 7, 2020
4600U Mar 16, 2020
4500U 6 (6) 2.3
Ryzen 3 Pro 4450U 4 (8) 2.5 3.7 4 MB 1 × 4 1400 320:20:8
5 CU
896 May 7, 2020
4300U 4 (4) 2.7 Mar 16, 2020
  1. All of the iGPUs are branded as AMD Radeon Graphics.
  1. Core Complexes (CCX) × cores per CCX
  2. Unified shaders : texture mapping units : render output units and compute units (CU)
  3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

H

Branding and model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[lower-roman 1]
Model Clock
(MHz)
Config[lower-roman 2] Processing
power
(GFLOPS)[lower-roman 3]
Base Boost
Ryzen 9 4900H 8 (16) 3.3 4.4 8 MB 2 × 4 Radeon
Graphics[lower-alpha 1]
1750 512:32:8
8 CU
1792 45 W Mar 16, 2020
4900HS 3.0 4.3 35 W
Ryzen 7 4800H 2.9 4.2 1600 448:28:8
7 CU
1433.6 45 W
4800HS
Ryzen 5 4600H 6 (12) 3.0 4.0 2 × 3 1500 384:24:8
6 CU
1152
4600HS[32][33][34] 35 W
  1. All of the iGPUs are branded as AMD Radeon Graphics.
  1. Core Complexes (CCX) × cores per CCX
  2. Unified shaders : texture mapping units : render output units and compute units (CU)
  3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Lucienne" (2021)

Common features of Ryzen 5000 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[lower-roman 1]
Model Clock
(GHz)
Config[lower-roman 2] Processing
power
(GFLOPS)[lower-roman 3]
Base Boost
Ryzen 7 5700U 8 (16) 1.8 4.3 8 MB
4 MB per CCX
2 × 4 Radeon
Graphics
[lower-alpha 1]
1.9 512:32:8
8 CU
1945.6 10–25 W Jan 12, 2021
Ryzen 5 5500U[35] 6 (12) 2.1 4.0 2 × 3 1.8 448:28:8
7 CU
1612.8
Ryzen 3 5300U 4 (8) 2.6 3.8 4 MB 1 × 4 1.5 384:24:8
6 CU
1152
  1. Core Complexes (CCX) × cores per CCX
  2. Unified shaders : texture mapping units : render output units and compute units (CU)
  3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. All of the iGPUs are branded as AMD Radeon Graphics.

"Cezanne" (2021)

U

Branding and model CPU GPU TDP Release
date
Cores
(Threads)
Clock rate (GHz) L3 cache
(total)
Core
config[lower-roman 1]
Model Clock
(GHz)
Config[lower-roman 2] Processing
power
(GFLOPS)[lower-roman 3]
Base Boost
Ryzen 7 5800U[note 1][36] 8 (16) 1.9 4.4 16 MB 1 × 8 Radeon
Graphics[lower-alpha 1]
2.0 512:32:8
8 CUs
2048 10–25 W Jan 12, 2021
Ryzen 5 5600U[note 1][37] 6 (12) 2.3 4.2 1 × 6 1.8 448:28:8
7 CUs
1612.8
5560U[38] 4.0 8 MB 1.6 384:24:8
6 CUs
1228.8
Ryzen 3 5400U[note 1][39][40] 4 (8) 2.7 4.1 1 × 4
  1. All of the iGPUs are branded as AMD Radeon Graphics.
  1. Core Complexes (CCX) × cores per CCX
  2. Unified shaders : texture mapping units : render output units and compute units (CU)
  3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. 1 2 3 Model also available as Pro version as 5450U,[41] 5650U,[42] 5850U,[43] released on March 16, 2021.

H

Branding and model CPU GPU TDP Release
date
Cores
(Threads)
Clock rate (GHz) L3 cache
(total)
Core
config[lower-roman 1]
Model Clock
(GHz)
Config[lower-roman 2] Processing
power
(GFLOPS)[lower-roman 3]
Base Boost
Ryzen 9 5980HX[44] 8 (16) 3.3 4.8 16 MB 1 × 8 Radeon
Graphics[lower-alpha 1]
2.1 512:32:8
8 CUs
2150.4 35–54 W Jan 12, 2021
5980HS[45] 3.0 35 W
5900HX[46] 3.3 4.6 35–54 W
5900HS[47] 3.0 35 W
Ryzen 7 5800H[48][49] 3.2 4.4 2.0 2048 35–54 W
5800HS[50] 2.8 35 W
Ryzen 5 5600H[51][52] 6 (12) 3.3 4.2 1 × 6 1.8 448:28:8
7 CUs
1612.8 35–54 W
5600HS[53] 3.0 35 W
  1. All of the iGPUs are branded as AMD Radeon Graphics.
  1. Core Complexes (CCX) × cores per CCX
  2. Unified shaders : texture mapping units : render output units and compute units (CU)
  3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Barceló" (2022)

Branding and model CPU GPU TDP Release
date
Cores
(Threads)
Clock rate (GHz) L3 cache
(total)
Core
config[lower-roman 1]
Model Clock
(GHz)
Config[lower-roman 2] Processing
power
(GFLOPS)[lower-roman 3]
Base Boost
Ryzen 7 5825U[note 1][note 2][54] 8 (16) 2.0 4.5 16 MB 1 × 8 Radeon
Graphics[lower-alpha 1]
2.0 512:32:8
8 CUs
2048 15 W Jan 4, 2022
Ryzen 5 5625U[note 1][note 2][55] 6 (12) 2.3 4.3 1 × 6 1.8 448:28:8
7 CUs
1612.8
Ryzen 3 5125C[56] 2 (4) 3.0 8 MB 1 × 2  ? 192:12:8
3 CU
 ? May 5, 2022
  1. All of the iGPUs are branded as AMD Radeon Graphics.
  1. Core Complexes (CCX) × cores per CCX
  2. Unified shaders : texture mapping units : render output units and compute units (CU)
  3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. 1 2 Model also available as Pro version as 5475U,[57] 5675U,[58] 5875U,[59] released on April 19, 2022.
  2. 1 2 Model also available as Chromebook optimized version as 5425C,[60] 5625C,[61] 5825C,[62] released on May 5, 2022.

"Rembrandt" (2022)

Common features of Ryzen 6000 notebook APUs:

  • Socket: FP7, FP7r2.
  • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Includes integrated RDNA2 GPU.
  • Fabrication process: TSMC 6 nm FinFET.
Branding and model CPU GPU TDP Release
date
Cores
(threads)
Clock (GHz) L3 cache
(total)
Core
config[lower-roman 1]
Model Clock
(GHz)
Config[lower-roman 2] Processing
power
(GFLOPS)[lower-roman 3]
Base Boost
Ryzen 9 6980HX 8 (16) 3.3 5.0 16 MB 1 × 8 680M 2.4 768:48:8
12 CUs
3686.4 45 W Jan 4, 2022
[63]
6980HS 35 W
6900HX[lower-alpha 1] 4.9 45 W
6900HS[lower-alpha 1] 35 W
Ryzen 7 6800H[lower-alpha 1] 3.2 4.7 2.2 3379.2 45 W
6800HS[lower-alpha 1] 35 W
6800U[lower-alpha 1] 2.7 15–28 W
Ryzen 5 6600H[lower-alpha 1] 6 (12) 3.3 4.5 1 × 6 660M 1.9 384:24:8
6 CUs
1459.2 45 W
6600HS[lower-alpha 1] 35 W
6600U[lower-alpha 1] 2.9 15–28 W
  1. Core Complexes (CCX) × cores per CCX
  2. Unified shaders : texture mapping units : render output units and compute units (CU)
  3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Mendocino (7020 series, Zen2/RDNA2 based)

Common features of Ryzen 7020 notebook APUs:

  • Socket: FT6
  • All the CPUs support LPDDR5-5500 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 4 PCIe 3.0 lanes.
  • Includes integrated RDNA2 GPU.
  • Fabrication process: TSMC 6 nm FinFET.
Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[lower-roman 1]
Model Clock
(GHz)
Processing
power[lower-roman 2]
(GFLOPS)
Base Boost
Ryzen 5 7520U[lower-roman 3] 4 (8) 2.8 4.3 4 MB 1 × 4 610M
2 CU
1.9 486.4 15 W 20 September 2022 (2022-09-20)[64]
Ryzen 3 7320U[lower-roman 3] 2.4 4.1
  1. Core Complexes (CCX) × cores per CCX
  2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  3. 1 2 Model also available as Chromebook optimized version as 7520C[lower-roman 4] and 7320C[lower-roman 5] released on May 23, 2023
  4. "AMD Ryzen 5 7520C". AMD.
  5. "AMD Ryzen 3 7320C". AMD.

Barcelo-R (7030 series, Zen3/GCN5 based)

Common features of Ryzen 7030 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[lower-alpha 1]
Model Clock
(GHz)
Processing
power[lower-alpha 2]
(GFLOPS)
Base Boost
Ryzen 7 (PRO) 7730U 8 (16) 2.0 4.5 16 MB 1 × 8 Vega
8 CU
2.0 2048 15 W 4 January 2023 (2023-01-04)
[65]
Ryzen 5 (PRO) 7530U 6 (12) 1 × 6 Vega
7 CU
1792
Ryzen 3 (PRO) 7330U 4 (8) 2.3 4.3 8 MB 1 × 4 Vega
6 CU
1.8 1382.4
  1. Core Complexes (CCX) × cores per CCX
  2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Rembrandt-R (7035 series, Zen3+/RDNA2 based)

Common features of Ryzen 7035 notebook APUs:

  • Socket: FP7, FP7r2.
  • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Includes integrated RDNA2 GPU.
  • Fabrication process: TSMC 6 nm FinFET.
Branding and model CPU GPU TDP Release
date
Cores
(threads)
Clock (GHz) L3 cache
(total)
Core
config[lower-alpha 1]
Model Clock
(GHz)
Processing
power[lower-alpha 2]
(GFLOPS)
Base Boost
Ryzen 7 7735HS 8 (16) 3.2 4.75 16 MB 1 × 8 680M
12 CU
2.2 3379.2 35–54 W 4 January 2023 (2023-01-04)[lower-alpha 3][66]
7736U 2.7 4.7 15–28 W
7735U 4.75 28 W
Ryzen 5 7535HS 6 (12) 3.3 4.55 1 × 6 660M
6 CU
1.9 1459.2 35–54 W
7535U 2.9 28 W
Ryzen 3 7335U 4 (8) 3.0 4.3 8 MB 1 × 4 660M
4 CU
1.8 921.6
  1. Core Complexes (CCX) × cores per CCX
  2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  3. HS versions launched 30 April 2023.

Phoenix (7040 series, Zen4/RDNA3 based)

Common features of Ryzen 7040 notebook APUs:

  • Socket: FP7, FP7r2, FP8.
  • All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All the CPUs support 20 PCIe 4.0 lanes.
  • Includes integrated RDNA 3 GPU.
  • Includes XDNA AI Engine (Ryzen AI).
  • Fabrication process: TSMC 4 nm FinFET.
Branding and model CPU GPU NPU TDP Release
date
Cores
(threads)
Clock (GHz) L3 cache
(total)
Core
config[lower-alpha 1]
Model Clock
(GHz)
Base Boost
Ryzen 9 (PRO) 7940HS 8 (16) 4.0 5.2 16 MB 1 × 8 780M
12 CU
2.8 Ryzen AI
Up to 10 TOPS
3554 W 3 May 2023 (2023-05-03)[lower-alpha 2][67]
7940H[lower-alpha 3]
Ryzen 7 (PRO) 7840HS 3.8 5.1 2.7
7840H[lower-alpha 3]
(PRO) 7840U 3.3 1530 W
Ryzen 5 (PRO) 7640HS 6 (12) 4.3 5.0 1 × 6 760M
8 CU
2.6 3554 W
7640H[lower-alpha 3]
(PRO) 7640U 3.5 4.9 1530 W
(PRO) 7545U 3.2 2 + 4 740M
4 CU
2.8 No
(PRO) 7540U 1 × 6 2.5
Ryzen 3 7440U 4 (8) 3.0 4.7 8 MB 1 + 3
  1. Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
  2. PRO versions launched on 13 June 2023.
  3. 1 2 3 China-only version of the HS SKU that lacks support for AMD EXPO™ and FreeSync™ technologies.

Dragon Range (7045 series, Zen4/RDNA2 based)

Common features of Ryzen 7045 notebook APUs:

  • Socket: FL1.
  • All the CPUs support DDR5-5200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All the CPUs support 28 PCIe 5.0 lanes.
  • Includes integrated RDNA2 GPU on the I/O die.
  • Fabrication process: TSMC 5 nm FinFET (6 nm FinFET for the I/O and graphics die).
Branding and model CPU GPU TDP Release
date
Cores
(threads)
Clock (GHz) L3 cache
(total)
Core
config[lower-alpha 1]
Model Clock
(GHz)
Base Boost
Ryzen 9 7945HX3D 16 (32) 2.3 5.4 128 MB[lower-roman 1] 2 × 8 610M
2 CU
2.2 55–75 W 27 July 2023 (2023-07-27)
7945HX 2.5 64 MB 28 February 2023 (2023-02-28)
[68]
7845HX 12 (24) 3.0 5.2 2 × 6 45–75 W
Ryzen 7 7745HX 8 (16) 3.6 5.1 32 MB 1 × 8
Ryzen 5 7645HX 6 (12) 4.0 5.0 1 × 6
  1. Core Complexes (CCX) × cores per CCX
  1. Only one of the two CCDs has the additional 3D V-Cache.

See also

References

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